| 摘要 |
PROBLEM TO BE SOLVED: To measure the depth of a laser-beam machined groove with accuracy higher than the accuracy of a groove depth measuring instrument without depending on the accuracy of the depth measuring instrument. SOLUTION: This groove depth measurement method for measuring the depth of the laser-beam machined groove 80, comprises a first groove depth measurement step and a plurality of other groove depth measurement steps. At the first step, one groove depth measurement route L1 is set parallel to the extending direction of the machined groove 80 formed in a wafer 34 to measure the depth of the machined groove 80 with the groove depth measuring instrument 70 positioned on the measurement route L1. At the depth measurement steps, the wafer 34 is cut and fed in order at regular intervals in a direction orthogonal to the measurement route L1 to measure the depth of the machined groove 80 each time the wafer 34 is positioned at other groove depth measurement routes L2 to Ln parallel to the measurement route L1. COPYRIGHT: (C)2006,JPO&NCIPI
|
