| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrolytic plating solution in which a recess in an article to be plated can be adequately embedded without complicate adjustment the plating solution. SOLUTION: The acidic solution for electrolytic copper plating indispensably includes a copper ion, and at least one acidic component selected from organic acids and inorganic acids, and further includes chloride ions in a range of 2 to 15 mg/L. The recess can be adequately embedded by electrolytic copper plating in the acidic solution. COPYRIGHT: (C)2006,JPO&NCIPI
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