| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface treatment method for copper by which adhesive strength between a copper surface and insulating layer is secured without forming ruggedness of >1μm on the copper surface, and insulation reliability between wiring therefore can be improved, and to provide copper. SOLUTION: The surface treatment method for copper comprises: a step where a metal nobler than copper is formed on a copper surface; and a step where the copper surface is subjected to oxidation treatment. COPYRIGHT: (C)2006,JPO&NCIPI
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