| 摘要 |
PROBLEM TO BE SOLVED: To reduce the cost of a device with compound substrates composed of a plurality of substrates. SOLUTION: A module substrate 20 mounting an electronic component 21 constituting a circuit is mounted on a mother board 10 mounting an electronic component 11 constituting a circuit. An electrode terminal 12 formed on the surface of the mother board 10 is connected with an electrode terminal 22 formed on the surface of the module board 20 through an electronic component 23, and the circuit of the mother board 10 is connected with the circuit of the module board 20. Since the mother board 10 and the module board 20 are connected by the electronic component 23, an end electrode is not required in the module board 20 and leads for connecting the mother board 10 and the module board 20 are not required. COPYRIGHT: (C)2006,JPO&NCIPI
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