| 摘要 |
PROBLEM TO BE SOLVED: To make the residual thickness of an adhesive filled in adhesive surfaces of an optical module and a packaging substrate uniform on the adhesive surfaces, to prevent inclination of the optical module with respect to the packaging substrate and to prevent the breaking of an optical transmission line. SOLUTION: The optical transmission line holding member 1 has: a holding hole 9 where the optical transmission line 2 is inserted and held; and a packaging surface 7 bonded to the packaging substrate 8, wherein electric wiring 4 is formed on an optical semiconductor loading surface 1a including one opening end of the holding hole 9 and the electric wiring 4 is extended up to a surface adjacent to the optical semiconductor loading surface 1a and different from the packaging surface 7, and regular rugged shapes are formed on the packaging surface 7. COPYRIGHT: (C)2006,JPO&NCIPI
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