EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, EPOXY RESIN COMPOSITION AND ELECTRONIC PART APPARATUS

摘要

PROBLEM TO BE SOLVED: To obtain a compound useful as a curing agent to make a cured product have low water absorption properties, to provide a method for producing the same and to provide an electronic part apparatus that uses an epoxy resin composition containing the compound and has excellent moisture proof reliability. SOLUTION: The method for producing an epoxy resin curing agent containing a compound having an aryloxysilyl bond comprises a process for reacting (a) a phenol compound containing two or more phenolic hydroxy groups in the molecule with (b) a silane compound represented by general formula (I): R2-SiR13. (R1s are each independently selected from a hydrogen atom and a 1-18C substituted or nonsubstituted hydrocarbon group and wholly the same or different and two or more of R1s may be mutually bonded to form a cyclic structure; R2is a functional group to be reacted with a phenolic hydroxy group and is selected from a group consisting of a hydroxy group, a 1-18C substituted or nonsubstituted monofunctional oxy group). COPYRIGHT: (C)2006,JPO&NCIPI