MATHOD FOR MANUFACTURING WIRING BOARD USING AG-PD ALLOY NANOPARTICLES

摘要

The PCB manufactured by spraying conductive ink dispersed with Ag-Pd alloy nanoparticles and curing to form wiring according to the present invention provides reduced migration of Ag ions. Further, the present invention provides a method for manufacturing PCB which exhibits competitive price, and excellent conductivity and anti-migration. As one aspect of the present invention, a conductive ink comprising Ag-Pd alloy nanoparticles, wherein the Ag-Pd alloy nanoparticles includes Pd in the range of from 5 weight % to 40 weight %.