| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve bondability of a wire to a lead and a physical quantity sensor chip, in a manufacturing method of a physical quantity sensor formed by electrically connecting the lead to the physical quantity sensor chip arranged slantingly thereto by the wire. <P>SOLUTION: This manufacturing method of the physical quantity sensor has a bonding process for bonding physical quantity sensor chips 3, 5 to a stage part by using a lead frame having the stage part and a plurality of leads 17, wherein the stage part is tilted to the leads 17; and a wiring process for electrically connecting each surface 3a, 5a of the physical quantity sensor chips 3, 5 tilted to the plurality of leads 17 to the surface 17a of each lead 17 mutually by the wire 40 by using a capillary 35. In the wiring process, the lead frame is rocked, and each surface 3a, 5a, 17a of the physical quantity sensor chips 3, 5 and each lead 17 is arranged approximately vertically to the direction of the capillary 35 respectively. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
