发明名称 PHOTOSENSITIVE COMPOSITION AND PATTERN FORMING METHOD USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive composition to be used for a semiconductor manufacturing process such as an IC, for manufacturing a circuit board of a liquid crystal, a thermal head or the like and for other photofabrication processes, and to provide a pattern forming method using the photosensitive composition, in particular, to provide a photosensitive composition having high exposure latitude, favorable PEB (post exposure bake) temperature dependency, and improved sensitivity and dissolution contrast in EUV exposure, and to provide a pattern forming method using the composition. <P>SOLUTION: The photosensitive composition contains a compound having a tricyano carbonium group which generates a specified organic acid by irradiation with actinic rays or radiation, and the pattern forming method is carried out by using the above photosensitive composition. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006251466(A) 申请公布日期 2006.09.21
申请号 JP20050068922 申请日期 2005.03.11
申请人 FUJI PHOTO FILM CO LTD 发明人 WADA KENJI
分类号 G03F7/004;C07C255/05;C07C381/12;H01L21/027 主分类号 G03F7/004
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