| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device with which adhesive property of a semiconductor element or a substrate loading the element and sealing resin is improved, in which reliability of the device is improved, and which is especially effective for an LED device. <P>SOLUTION: In the manufacturing method of the semiconductor device having the semiconductor element and/or the substrate loaded with the semiconductor element, the semiconductor element and/or the substrate loaded with the semiconductor element is plasma-treated, priming is performed with a primer composite and the semiconductor element is sealed by semiconductor encapsulant as a pre-process for sealing the semiconductor element with semiconductor encapsulant. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
