PACKAGING OF LED WITH HIGH PERFORMANCE FOR HEAT DISSIPATION

摘要

PROBLEM TO BE SOLVED: To provide a non-expensive system and method for improving a heat dissipation of LED display using a conventional PCB package mounted in a LCD panel supporting structure.

SOLUTION: The heat dissipation from a die to a rear structure is optimized by making a passage of heat from the LED separate from a passage of electricity. A heat dissipation pad is prepared in a substrate bottom surface as a heat sink, and within a reflection cup prepared in the substrate, the LED and a heat sink pad are joined in thermal conductivity and non-electrical conductivity.

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