| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a lead frame with sufficient manufacture precision, with which a use amount of plating liquid is made necessary minimum, cost required for plating is reduced, and manufacture cost is reduced. SOLUTION: First pilot holes 11 are formed on both sides of a metal bar 10 at prescribed intervals. A first resist film 12 is formed in a region except for both sides. In the first resist film 12, noble metal plating patterns 13 formed in a wire bonding region are exposed and developed. Prescribed noble metal plating is performed in a noble metal plating region, and the first resist film 12 is peeled. A second resist film 14 is formed in the region except for the both sides of the metal bar 10. Patterns 18a and 17a of the second pilot holes 18 and the lead frame 17 are exposed and developed on both sides of the second resist film 14. The metal bar 10 where the lead frame patterns are formed is etched by the second resist film 14. The second resist film 14 is peeled and the lead frame 17 is formed. COPYRIGHT: (C)2006,JPO&NCIPI |
