| 摘要 |
PROBLEM TO BE SOLVED: To provide a method wherein for surely fixing a heat sink without the need of particular processing for a semiconductor device by making minimum an occupation area on a printed board while mechanically fixing the heat sink. SOLUTION: There are provided the semiconductor device 100 including an interposer 103 packaged on a printed wiring board 4, and the heat sink 104 mounted on the upper surface of the semiconductor device 100. The heat sink 104 consists of a member 106 for holding the lower surface of the interposer 103 of the semiconductor device 100 and a rotation stopping member 107. COPYRIGHT: (C)2006,JPO&NCIPI |
