| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer flexible circuit wiring board along with its manufacturing method, capable of both assuring of through-hole connection reliability and formation of fine pattern on a surface layer. SOLUTION: A metal foil which comprises heterogeneous metal that comes to be an etching stopper layer is prepared between a first conductive layer and a second conductive layer. A circuit pattern is formed on the first conductive layer by etching, and an adhesive insulating resin is bonded to a circuit pattern side. It is laminated on the metal foil or circuit base material comprising at least one circuit pattern layer through the adhesive resin or another bonding agent. A hole for conduction is formed and interlayer connection is performed by electric plating. Then the second conductive layer at a needless point is etched, and the heterogeneous metal layer which is the etching stopper is selectively removed by etching. COPYRIGHT: (C)2006,JPO&NCIPI |
