Holder for electronic component, holding sheet for electronic component, electronic module using holder, electronic module using holding sheet, lamination of electronic modules, method for manufacturing electronic module, and method for testing electronic module

摘要

A first cavity in a holder is provided with a plurality of spiral contactors and a thermosetting adhesive member. In a state where a first bare chip is mounted in the first cavity and spherical contactors on the first bare chip are pressed against the plurality of spiral contactors, various tests are performed. If the result of the test is pass, the holder is heated so that the adhesive member becomes hard and rigid by being heated. This can perform securing while a good connection between the first bare chip and the holder is maintained. If the result of the test is fail, only the first bare chip is removed and replaced with a new bare chip.