METHOD FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

To bring a probe into contact with a test pad without breaking a circuit formed in a chip during probe inspection, a weighted jig (14), a pressing tool (9), an elastomer (9A), an adhesion ring (6) and a plunger (3) are integrated by fixing them with screw nuts (11, 13) and a bolt (16C), an elastic force of a spring (19) arranged between a spring holding jig (18) and the weighted jig (14) is permitted to operate to press down the integrated member toward pads (PD3, PD4), and a pressing force transmitted from a spring (3A) in the plunger (3) to a thin film sheet (2) is used only for stretching the thin film sheet (2).