| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a failure analysis system assuring an observation test piece responding to an optional observation desired place determined by inspection afterward in the failure analysis of a device. <P>SOLUTION: After the completion of an optional device process, a part of wafer 108 is extracted by probe and put on a minute test piece storage implement 109 as the minute test piece 110 of a size equal to or more than one repetition pattern using a minute test piece extraction apparatus 102. The part of wafer is stored in a minute test piece storage apparatus 103. Data of a storage test piece are administered by a storage test piece data storage apparatus 104. After the determination of an observation desired place from a failure analysis request 120 after the subjection of wafer 108 to a post-process, a minute test piece 110 is extracted from the minute test piece storage implement 109 using a minute test piece additional processing apparatus 105, a failure analysis test piece 113 is manufactured using the additional processing of the observation desired place by putting the test piece on an observation test piece holder, and analysis information 118 analyzed by a failure analysis apparatus 106 is output. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
