| 摘要 |
PROBLEM TO BE SOLVED: To prevent a lead pin of an IC package from being deformed or to prevent a contact of a socket housing from being deformed in an IC socket assembly, and to improve the operability of the IC package or the like. SOLUTION: The IC socket assembly 1 includes numerous electric contacts 30, an IC socket 2 having an urging member 8 for energizing an insulative socket housing 6 for carrying the electric contacts 30 and the IC package 100 mounted on an IC package mounting face to electrically contact with the contacts 30. The IC package 100 has a frame member 100b along the periphery of the package 100. COPYRIGHT: (C)2006,JPO&NCIPI
|
