发明名称 SURFACE TREATMENT METHOD
摘要 PROBLEM TO BE SOLVED: To prevent the occurrence of a defect of insufficient bonding in a building-up layer 39 even in the case where the length of a part 3 to be treated of a work 1 is larger than the width of an electrode 35. SOLUTION: In this surface treatment method, while the electrode 35 is relatively moved along the part 3 to be treated of the work 1, a pulse-like discharge is generated between the part 3 to be treated of the work 1 and the electrode 35, thereby depositing material of the like of the electrode 35 on the part 3 to be treated of the work 1 by the discharge energy to continuously form the building-up layer 39 along the part 3 to be treated of the work 1. The relative moving speed of the electrode 35 is a very low speed so that discharge is continued between the edge side 41a of the electrode recessed part 41 and the bottom side 43a of the building-up projecting part 43. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006247761(A) 申请公布日期 2006.09.21
申请号 JP20050064486 申请日期 2005.03.08
申请人 ISHIKAWAJIMA HARIMA HEAVY IND CO LTD;MITSUBISHI ELECTRIC CORP 发明人 OCHIAI HIROYUKI;WATANABE MITSUTOSHI;FURUKAWA TAKASHI
分类号 B23H9/00;B23H1/04 主分类号 B23H9/00
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