| 摘要 |
A flip-chip-on-film package structure includes a flexible substrate, a flip chip, and a first heat sink. The flexible substrate has an upper surface and a lower surface. The flip chip is mounted on the upper surface of the flexible substrate and electrically connected to the flexible substrate. The first heat sink is disposed on the lower surface of the flexible substrate and used for dissipating the heat generated by the flip chip during operation. Moreover, the first heat sink can also improve the strength of the package structure.
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