发明名称 |
Low surface roughness electrolytic copper foil and process for producing the same |
摘要 |
An electrodeposited copper foil with low surface roughness having a surface roughness R<SUB>z </SUB>not higher than 2.5 mum and an elongation percentage not smaller than 6% at 180° C. in which tensile strength at 25° C. measured within 20 min of the point in time of ending electrodeposition is not higher than 500 MPa and the lowering rate of tensile strength at 25° C. measured within 300 min of the point in time of ending electrodeposition is not higher than 10%. The electrodeposited copper foil with low surface roughness is produced by a process employing aqueous solution of sulfuric acid-copper sulfate as electrolyte and conducting a DC current between an insoluble anode of titanium coated with a platinum metal element or its oxide element and a titanium cathode drum facing the anode, wherein the electrolyte contains hydroxyethylcellulose, polyethyleneimine, a sulfonate of active organic sulfur compound, acetylene glycol and chlorine ions.
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申请公布号 |
US2006210823(A1) |
申请公布日期 |
2006.09.21 |
申请号 |
US20050555356 |
申请日期 |
2005.11.01 |
申请人 |
SANO YASUSHI;AKAMINE NAOSHI |
发明人 |
SANO YASUSHI;AKAMINE NAOSHI |
分类号 |
C25D3/38;B21C37/00;B23P9/00;C25D1/00;C25D1/04;H05K1/09 |
主分类号 |
C25D3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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