发明名称 PATTERN FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To reduce a size of an opening portion without deteriorating a shape of the opening portion consisting of a hole or a groove formed on a resist pattern. <P>SOLUTION: A resist film 11 composed of a chemically amplified resist material having: a base polymer containing a protecting group which is removed by the action of an acid; an acrylic compound; and an acid generator which generates an acid on light irradiation is formed. Pattern exposure is conducted by making exposure light 12 irradiate the resist film 11 via a mask 13. The resist pattern 16 having the opening portion 15 consisting of the hole or the groove is formed by developing the pattern exposed resist film 11. The size of the opening portion 15 is reduced by making light irradiate the resist pattern 16 under heating. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006251826(A) 申请公布日期 2006.09.21
申请号 JP20060147683 申请日期 2006.05.29
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ENDO MASATAKA;SASAKO MASARU
分类号 G03F7/40;G03F7/039;H01L21/027 主分类号 G03F7/40
代理机构 代理人
主权项
地址