| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit device realizing both heat dissipation and pressure resistance, and its manufacturing method. <P>SOLUTION: A first insulation layer 12A is formed on the surface of a circuit board 11, and a second insulation layer 12B is formed on its rear. A conductive pattern 13 is formed on the surface of the first insulation layer 12A, and a circuit element 15 is fixed to the conductive pattern 13. In addition, a metallic substrate 16 is stuck to the surface of the second insulation layer 12B. Sealing resin 14 covers the surface and side faces of the circuit board 11, and also covers the periphery of the rear face of the board 11 to have the rear face of the metallic substrate 16 exposed. Thus, heat dissipation and pressure resistance of the circuit board 11 can be secured. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
