| 摘要 |
PROBLEM TO BE SOLVED: To provide a chucking device capable of fixing a semiconductor substrate on a stage with reduced frictional force applied to the substrate. SOLUTION: An electrostatic chuck 11 has the stage 13. The stage 13 has a first chucking part 16 capable of chucking the vicinity of a periphery of a wafer 12, and a second chucking part 17 capable of chucking the vicinity of the center of the wafer 12. The first part 16 is equipped with a first electrode 19 and a second electrode 20. The second part 17 is equipped with a third electrode 21 and a fourth electrode 22. Voltage is applied only to the first and second electrodes 19 and 20 of the first part 16 to chuck only the periphery 12b of the wafer 12 which is protrusively curved from the stage 13. COPYRIGHT: (C)2006,JPO&NCIPI |
