| 摘要 |
PROBLEM TO BE SOLVED: To provide an efficient method of manufacturing an electronic component having electric reliability without executing a process of non-electrolytic plating. SOLUTION: In order to embed a conductor into an opening 28 formed on a base material 22 of an electronic component, first, a mask 32 is formed so that the conductor 30 to be filled into the opening 28 may not contact an upper conductor 24. Subsequently, metallic plating is grown from a lower conductor 26 side of the opening 28, using the lower conductor 26 as an electrode, and the metallic plating is filled into the opening 28. Subsequently, the mask 32 is removed, and the metallic plating filled into the opening 28 is connected by plating to the upper conductor 24, using the upper conductor 24 or the lower conductor 26 as an electrode. COPYRIGHT: (C)2006,JPO&NCIPI |
