| 摘要 |
PROBLEM TO BE SOLVED: To inspect sensor characteristics in a state of wafer. SOLUTION: In an inspection device 200 for inspecting the electric characteristic of a humidity sensor 100 wherein a detection part 61 for detecting a surrounding humidity and a circuit part 70 for processing a detection signal from the detection part 61 are constituted in one chip, in the state of a wafer W before being divided into each chip, a temperature/humidity adjusting part 230 for supplying into a prober part 222 gas whose temperature/humidity is adjusted into a prescribed condition, and replacing the inside of the prober part 222 with the gas is provided. Since the temperature/humidity in the prober part 222 can be adjusted into a prescribed condition, not only a probing test but also inspection of the sensor characteristics (sensitivity and a temperature characteristic of the sensitivity, and offset and a temperature characteristic of the offset) can be performed in the state of the wafer W. Namely, manufacturing cost can be lowered. COPYRIGHT: (C)2006,JPO&NCIPI
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