MEMS ELEMENT PACKAGE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide MEMS (micro-electro mechanical system) element package having stable action and high reliability. SOLUTION: The MEMS element package includes an element substrate 100 formed with MEMS active element 100 on one surface; a multiple sealing pad 200 for providing an electric route of the MEMS active element and surrounding the MEMS active element in multiple in order to protect the MEMS active element from the outside; a cap substrate 300 bonded to the element substrate through the multiple sealing pad and formed with a via hole 320 at a trench 310 where the MEMS active element is positioned and a portion where the multiple sealing pad is positioned; and an external electrode pad 400 formed on one surface of the cap substrate so as to form electrical connection with the multiple sealing pad through the via hole. COPYRIGHT: (C)2006,JPO&NCIPI