Semiconductor component has surface mountable external contacts, which has external contact surface on lower surface of housing of semiconductor components whereby drain contact surface is provided at rear surface of semiconductor chip

摘要

Semiconductor component (1) has surface mountable external contacts (2-5), which has external contact surface on the lower surface (6) of the housing (7) of the semiconductor components. A source contact surface (10) and a gate contact surface (11) are provided at the top surface (9) of the semiconductor chip (8) whereby a drain contact surface is provided at the rear surface (12) of semiconductor chip. A cooling body (13) is provided, which has a top surface (14), a lower surface (15) and a recess (16) on the lower surface whereby its top surface forms a coplanar upper surface with the housing upper surface (17). The semiconductor chip is arranged with the source contact area in the recess and this source contact area is electrically connected with the cooling body. The lower surface of the cooling body and the drain contact area of the semiconductor chip are arranged in the housing plane, which is formed by the surface-mountable external contacts. The lower surface of the cooling body with a source external contact (S) and the drain contact area with the drain external contact (D) and the gate contact area with the gate external contact (G) stand in electrical connection on the lower surface of the semiconductor component by a connecting element (19). An independent claim is also included for the method for the production of the semiconductor component.