| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for encapsulating a semiconductor which contains neither halogen type nor antimony type flame retardants, has flowability before the cure and after the cure excels in flame retardancy, heat resistance and moisture resistance. SOLUTION: The epoxy resin composition for semiconductor encapsulation contains, based on (A) 100 pts.wt. of an epoxy resin, (B) 50-150 pts.wt. of an acid anhydride, (C) 1-70 pts.wt. of a phosphazene compound such as hexaphenoxy cyclotriphosphazene and (D) 10-170 pts.wt. of magnesium hydroxide, and further contains (E) 40-90 wt% of an inorganic filler in the composition. The composition has a viscosity of 5,000-2,000,000 mPa s at room temperature. COPYRIGHT: (C)2006,JPO&NCIPI
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