| 摘要 |
PROBLEM TO BE SOLVED: To perform board analysis with high accuracy within a feasible computation time, accurately regenerating the effect on substrate behavior caused by a wiring pattern in a printed board. SOLUTION: A substrate analysis method includes acquiring data related to the shape of the printed board 4, a wiring pattern, materials of a conductor and an insulator and a substrate lamination form, generating an analysis model form of the substrate from the above data, so as to divide into an arbitrary cell area, calculating and inputting physical values for analysis from wiring pattern information corresponding to the divided cell area, and performing analysis calculation based on the generated analysis model. By the method, it becomes possible to refrain the required number of meshes and minimize the processing data volume. COPYRIGHT: (C)2006,JPO&NCIPI
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