METHOD AND APPARATUS OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method and an apparatus of manufacturing a semiconductor device which can positively suppress positional deviation of a heat dissipation plate at a low cost. SOLUTION: A thermal conductive resin 20 is applied or stuck on a joining part of at least any one of a semiconductor element 11 and a heat dissipating plate 18 which are connected by flip chip on a circuit board 12. An adhesive 19 is applied or stuck on the joining part of at least any one of the circuit board 12 and the plate 18. A guide 25 for preventing the positional deviation of the plate 18 is disposed on the upper part of an external periphery of the circuit board 12, and the plate 18 is mounted on the circuit board 12. The resin 20 and the adhesive 19 are cured while preventing the positional deviation of the plate 18 by the guide 25 to fix the plate 18. COPYRIGHT: (C)2006,JPO&NCIPI