| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which overlaps a plurality of semiconductor chips for molding, while decreasing a thickness of a package external shape, wherein the high reliability of a ball bump is materialized. <P>SOLUTION: A ball bump 33 makes use of ball bonding of a bonding wire 32, and a capillary 30 arranged with a ball 33 is used at a distal end thereof. The ball 33 is secured to a bonding pad 12a, and the capillary 30 is lifted up and moved horizontally so that the bonding wire near a root of the ball 33 is not received in the capillary, whereby a fine bonding wire is formed between the ball and the bonding wire. In such a state that the fine bonding wire is contiguous to the ball 33, the bonding wire is clamped and the capillary is lifted up, whereby the fine bonding wire is cut. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
