| 摘要 |
PROBLEM TO BE SOLVED: To improve the uniformity of an accuracy (a line width) on a treatment by suppressing the dispersion of the accuracy (the line width) on the treatment by shortening the coating time of a treatment liquid while enhancing a throughput, and to miniaturize a device. SOLUTION: In a method for treating a substrate, the square-shaped substrate to be treated G and a treatment-liquid supply means oppositely arranged to the substrate to be treated so as to coat the whole of one side of the substrate to be treated are displaced relatively in parallel, and the surface of the substrate to be treated is coated with a developer as the treatment liquid. In the method for treating the substrate, a pair of treatment-liquid supply nozzles 52a and 52b constituting the treatment-liquid supply means are arranged at the central section of the substrate to be treated, each treatment-liquid supply nozzle is moved to the opposed edges of the substrate to be treated respectively while supplying the developer from both treatment-liquid supply nozzles respectively and the developer is applied (a liquid swelling). COPYRIGHT: (C)2006,JPO&NCIPI
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