| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for managing the equipment program of a semiconductor fabrication system in which the manhour and required time can be reduced when the equipment program being stored in the semiconductor fabrication system is replaced. SOLUTION: In the method for managing the equipment program of a bonding unit BN which can perform a predetermined bonding processing on a plurality of kinds of product (IC), a plurality of bonding units BN are prepared and the method comprises a step for storing a plurality of kinds of equipment program set, respectively, for every kind of product and every serial number of bonding unit BN in a file server 10, and a step for selecting an arbitrary equipment program C-1 among the plurality of kinds of equipment program stored in the file server 10 and transferring the selected equipment program C-1 from the file server 10 to the bonding unit BN. A dedicated equipment program set finely for every kind of product and every serial number of bonding unit BN can thereby be selected. COPYRIGHT: (C)2006,JPO&NCIPI
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