SEALING STRUCTURE, SEALING METHOD, PROXIMITY SENSOR AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a sealing structure allowing a sealing process in an opening of a case body for inserting and arranging a wiring member therein to be easily and efficiently carried out without increasing the size of a product, and capable of keeping high junction reliability in a solder junction part. SOLUTION: This proximity sensor is provided with: a resin case 112 being the case body having the opening 113; an output circuit board 131 inserted and arranged in the opening 113 and being the wiring member having electrodes 132 for solder junction outside the resin case 112; a flux-coated layer 170 for closing a space between the inside wall surface of the opening 131 and the output circuit board 131; terminals 151 of a cord 150 for external connection jointed to the electrodes 132 for solder junction; and a secondary casting resin layer 180 covering the flux-coated layer 170 inside the resin case 112 and fixed to the resin case 112. COPYRIGHT: (C)2006,JPO&NCIPI