| 摘要 |
PROBLEM TO BE SOLVED: To provide a film-forming composition, especially the film-forming composition capable of providing an insulation film usable for an electronic device, having a low dielectric constant and hardly changing the relative dielectric constant with time; and to provide the insulation film, and the electronic device having the insulation film. SOLUTION: The film-forming composition contains a compound having a cage-shaped structure, and contains≤1 mass% component having≥70°C and≤110°C boiling point at 1 atm. The insulation film using the composition, and the electronic device are also provided. COPYRIGHT: (C)2006,JPO&NCIPI
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