发明名称 |
Heat sink for surface-mounted semiconductor devices and mounting method |
摘要 |
A heat sink for surface-mounted semiconductor devices is provided on a superordinate circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on region and are spring-elastically connected to the press-on region of the heat sink via a spring-elastic connecting region of the heat sink. The snap-action hooks engage with edge regions of a thermally conductive coupling plate with the press-on region generating pressure. The coupling plate is fixed to a rear side of a semiconductor chip of the surface-mounted semiconductor device.
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申请公布号 |
US2006209513(A1) |
申请公布日期 |
2006.09.21 |
申请号 |
US20060375565 |
申请日期 |
2006.03.15 |
申请人 |
GRUENDLER GEROLD;HOEGERL JUERGEN;KILLER THOMAS;STRUTZ VOLKER;SYRI ERICH |
发明人 |
GRUENDLER GEROLD;HOEGERL JUERGEN;KILLER THOMAS;STRUTZ VOLKER;SYRI ERICH |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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