MASKLESS EXPOSURE APPARATUS, EXPOSURE METHOD THEREOF, AND METHOD FOR MANUFACTURING WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a maskless exposure apparatus that achieves maskless direct exposure on a general-use photosensitive resin with a high throughput and no defect, and to provide an exposure method and a method for manufacturing a wiring board.

SOLUTION: The maskless exposure apparatus is equipped with: a main irradiation optical system 3 which emits UV exposure light; an exposure head 30 which includes a light modulating optical system 5 modulating the emitted UV exposure light by each pixel to form a desired exposure pattern, and an imaging optical system 7 imaging the desired exposure pattern on the surface of an exposure object; a scanning means 2 which relatively scans the surface of the exposure object with the desired exposure pattern imaged by the imaging optical system of the exposure head; and a color tone measuring means 12 which measures tone pattern data on the surface of the exposure object.

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