| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laminate suitable for flexible printed wiring boards or suspensions for HDDs, having excellent adhesion between metallic foil and a polyimide resin layer, and allowing to easily obtain good etching shapes. <P>SOLUTION: The laminate comprises the metallic foil and the polyimide resin layer. The polyimide resin layer is formed by coating precursor solution of polyimide resin directly on the metallic foil. The polyimide resin formed by hardened precursor solution contains 50 pts.wt. or more of component represented by a general formula (1). A coefficient of linear expansion of the entire polyimide resin layer is 10-30 ppm/K, and adhesion strength between the metallic foil and the polyimide resin layer is 0.5 kN/m or higher. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
