| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of surface processing of a copper foil which has high versatility to improve bonding strength between the copper foil and an insulating substrate. SOLUTION: A metal material for a printed wiring board is characterized in that Ti of 1μmol/m<SP>2</SP>or more exists on the surface of the copper foil and the Ti is a metal alkoxide or an organic metal coupling agent. COPYRIGHT: (C)2006,JPO&NCIPI
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