发明名称 SPUTTERING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a sputtering apparatus provided with anti-deposition plates for particularly preventing deposition of an insulator or the like to the wall surface of a vacuum vessel for ensuring formation of the film of a desired composition without inclusion of a foreign matter, and maintaining productivity by preventing change in the condition of plasma by aging. SOLUTION: The anti-deposition plates are formed of a metal material in duplication under the non-contact conditions. A DC negative potential is impressed to the external anti-deposition plate among the duplicated anti-deposition plates. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006253275(A) 申请公布日期 2006.09.21
申请号 JP20050065255 申请日期 2005.03.09
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SHIBUYA KIYOSHI;HIRATA SHINJI;NAKANO MITSUHIKO;IMANAKA SEIJI
分类号 H01L21/31;C23C14/34 主分类号 H01L21/31
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