发明名称 |
THIN PACKAGE FOR A MICRO COMPONENT |
摘要 |
<p>Techniques are disclosed for fabricating a relatively thin package for housing a micro component, such as an opto-electronic or MEMs device. The packages may be fabricated in a wafer-level batch process. The package may include hermetically sealed feed-through electrical connections coupling the micro component to electrical contacts on an exterior surface of the package.</p> |
申请公布号 |
WO2006097842(A1) |
申请公布日期 |
2006.09.21 |
申请号 |
WO2006IB00661 |
申请日期 |
2006.03.15 |
申请人 |
HYMITE A/S;SHIV, LIOR;BLIDEGN, KRISTIAN |
发明人 |
SHIV, LIOR;BLIDEGN, KRISTIAN |
分类号 |
B81B7/00;H01L23/10;H01L23/48 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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