| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC card module allowing mounting of a semiconductor chip holding parallelism on a base material. <P>SOLUTION: When joining a bump 11 provided in an electrode of the semiconductor chip 12 to an antenna circuit pattern 14 on the base material 13, a thickness of heat-shrinking adhesive 17 can be thinned because a dummy pad 15 is provided on the base material 13 opposite to a portion having no bump 11 provided in the semiconductor chip 12, so as to hold the parallelism of the semiconductor chip 12. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
