| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device wherein underfill with a low viscosity can simply be applied to a wire bonding region without causing resin contamination to the wire bonding region, and a solder flow caused by molding of semiconductors chip can be prevented. SOLUTION: In the semiconductor device, the semiconductor chips 12-1, 12-2 and passive components 15-1, 15-2, 15-3 are three-dimensionally arranged with a substrate 100, a cavity 102 formed on the front side of the substrate, the passive components 15-1, 15-2, 15-3, the under fill 19 filled in the cavity, the semiconductor chips 12-1, 12-2 placed on the underfill, and wires 14-1, 14-2 for joining each semiconductor chip to the outside of the cavity. COPYRIGHT: (C)2006,JPO&NCIPI |
