| 摘要 |
PROBLEM TO BE SOLVED: To provide a new solder resist flame-retardant composition for forming a protective film used to manufacture a printed circuit board or the like. SOLUTION: The solder resist flame-retardant composition comprises an unsaturated group containing polycarboxylic acid resin (A), configured by adding a polybasic acid anhydride (c), a photoinitiator (B), an epoxy resin (C), a flame retarder (D), and a hydrated metal compound (E). The polycarboxylic acid (A) is contained in a reaction product of a bisphenol type epoxy resin (a) expressed by the following general formula (I): (wherein, n is an integer of 0-10, X is selected out of methylene group, ethylidene group, isopropylidene group, sulfonyl group, and a single bond, and Y is hydrogen atom or 2, 3-epoxypropyl group) and an unsaturated group containing monocarboxylic acid (b). The flame-retardant composition is excellent in low tacking property, flexibility, and PCT resistance. COPYRIGHT: (C)2006,JPO&NCIPI
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