| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation structure of an electronic part with a heat sink that can effectively dissipate heat emitted by the electronic part with the heat sink such as ICs, CPUs, etc. without losing the freedom of circuit design, and a recording device having the heat dissipation structure of the electronic part with the heat sink. SOLUTION: The structure of includes a main substrate 110, an integrated circuit IC130 including a heat sink 132, a ground pattern 115 formed on the opposite surface 110b of the main substrate 110 or its inner layer, a via-hole 114 formed by penetrating the main substrate 110, a shield cover 120 formed so as to cover the main substrate 110 and the IC 130 with the heat sink, and joints (a via-hole 116 and ground joint 117) arranged near the IC 130 with the heat sink, thus dissipating heat emitted from the IC 130 with the heat sink to the shield cover 120 via the heat sink 132, the via-hole 114, the ground pattern 115, the via-hole 116, and the ground joint 117. COPYRIGHT: (C)2006,JPO&NCIPI
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