| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce a calculation time for the correction amount of a wiring pattern in an exposure method for exposing a substrate by placing a plurality of wiring patterns at predetermined positions of a substrate, wherein a plurality of reference marks preliminarily disposed on a substrate are detected to acquire detected position information and the position of a wiring pattern placed on the substrate is corrected to carry out exposure, based on the detected position information and exposed by the detection position information. <P>SOLUTION: A reference mark 12a preliminarily disposed on a substrate 12 based on reference mark position information is detected to acquire detected position information showing the position of the reference mark 12a; and drawing position information 12c showing positions of wiring patterns P1 to P3 in wiring patterns P1 to P4 disposed at predetermined positions on the substrate 12 are corrected according to the misalignment between the detected position information of the reference mark 12a and the reference mark position information. A correction amount of the wiring pattern P4 is obtained, based on the correction amounts by drawing position information 12c of the wiring patterns P1 to P3; and the wiring pattern P4 is corrected using the obtained correction amount. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
