| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin composition for printed wiring boards, giving cured products having physical properties such as flame retardancy, heat resistance and dielectric characteristics, to provide a resin composition for printed wiring boards, to provide a resin composition for interlayer insulation materials, used for printed wiring boards and resin-having copper foils, to provide a resin composition for sealing electronic parts, to provide an epoxy resin composition which can be preferably used for resin inks, conductive pastes, coatings, adhesives, composite materials, and the like, to provide cured products thereof, and to provide a phenolic resin composition which can suitably be used as a curing agent for epoxy resins. <P>SOLUTION: This epoxy resin composition is characterized by comprising a phenolic resin composition (A) comprising a condensation product (I) obtained by reacting a phenol compound with a triazine ring-having compound and a hydroxy group-substituted aromatic aldehyde compound, and an epoxy resin (B). The cured product produced by curing the epoxy resin composition. The phenolic resin composition comprises the condensation product (I) obtained by reacting the phenol compound with the triazine ring-having compound and the hydroxy group-substituted aromatic aldehyde compound. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
