| 摘要 |
PROBLEM TO BE SOLVED: To provide a pattern shaped-body capable of further miniaturization of wiring, and to provide a method of manufacturing the wiring and a wiring board. SOLUTION: A pattern having an opening size of 20μm is formed on a mold, and then, an ink containing silver nano-particles is supplied to the entire pattern. In this case, a coating layer 3 made of silver nano-particles is formed on the opening, and further, the silver nano-particles are fused. The mold is dipped into a copper pyrophosphoric acid solution, and copper plating is executed so that the film thickness is 3μm. After that, an enclosure is provided using a frame material 5, a molding resin 6 for transfer is injected in a molten state, molding is performed and the mold is released after temporary curing, and a molded body having a transferred wiring 4 is cured to form the wiring. According to this procedure, a pattern-like insulating material is disposed on the substrate material, an exposed area of the substrate material surface is made smaller than an area of the opening on the surface of the insulating material, and the shape of a cross section is made to be a mound shape. Thus, since a force of exfoliating the molded body from the mold is decreased against an adhesion force to a substrate, the wiring can be satisfactorily transferred. COPYRIGHT: (C)2006,JPO&NCIPI
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