发明名称 SUBSTRATE TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate treatment device capable of quickly recovering a substrate upon an emergency stop or the like. SOLUTION: A multi-chamber type continuous treatment device is equipped with a negative pressure transfer chamber 10 with a negative pressure transfer device 12 installed therein to transfer a wafer W, a plurality of treatment modules 61, 62, 63, 64 connected to the negative pressure transfer chamber 10 to treat the wafer W, a carry-in chamber 20 for carrying the wafer W in, a carry-out chamber 30 for carrying the wafer W out, and a control system 70 for controlling the elements. The control system 70 is equipped with an indicating system 90 for indicating the wafer before treatment and the wafer after treatment. The indicating system 90 is provided with a selecting means for selecting a second treatment module 62 among a plurality of treatment modules, and an indicating means for indicating a wafer whether the same is before the treatment of the selected second treatment module 62 or the same is after the treatment of the selectee second treatment module 62. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006253483(A) 申请公布日期 2006.09.21
申请号 JP20050069368 申请日期 2005.03.11
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 MATSUNAGA CHIKAKO
分类号 H01L21/677;H01L21/02 主分类号 H01L21/677
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